Thermal properties and plasma resistance of
bismuth aluminosilicate glasses
BYUN Y. 1,2, CHOI J. 1,2, IM W. 1, KIM H. 2
1 Division of Materials Science and Engineering, Hanyang University, Seoul, Korea (Republic of); 2 Engineering Materials Center, Korea Institute of Ceramic Engineering and Technology, Icheon, Korea (Republic of)
The effects of the components on the thermal properties and CF4/Ar/O2 plasma erosion resistance of Bi2O3-Al2O3-SiO2 glasses were studied. As the Bi2O3 content increased, the glass transition temperature decreased and the thermal expansion coefficient increased. The plasma etch rate increased with increasing Bi2O3 and SiO2 contents, and Al2O3 showed the opposite trend. The Bi2O3-Al2O3-SiO2 glass showed an etch rate of about 40-80% compared to quartz glass (224 nm/min).