One of the limitations of Solid Oxide Cell (SOC) lifetime is the degradation of metal interconnects. Protective coatings are an established approach to protect the interconnect substrate (stainless steel based) in terms of corrosion and Cr evaporation loss at high temperatures. (Mn,Co)3O4 spinel has received extensive attention for the coating material because it meets the requirements well overall (e.g. thermal expansion coefficient, electrical conductivity). There is an interest to explore Cobalt-free coating materials because Co is a critical and expensive element. In the present study, the focus is on the substitution of Co with Cu, since based on physical properties it seems to be a promising candidate for the purpose of interconnect coating. 
Regarding the coating deposition technique, there is a choice of methods that can provide a dense and protective film. In the present study, the electrophoretic deposition method (EPD) was developed to deposit a MnCuO spinel coating onto the SOC interconnect. The EPD suspensions were properly formulated and deposition and heat-treatment parameters were optimized to obtain 10-12 µm thick MnCuO coatings.
 The performance of MnCuO coated interconnects was investigated with standard and accelerated ex-situ corrosion ageing tests based on a modified 4-probe testing method. Area Specific Resistance (ASR) and Cr depletion/migration were studied for the tested samples. Scanning Electron Microscopy (SEM) and Energy Dispersive X-Ray Spectroscopy (EDX) post-test characterizations provide information on the oxide scale morphology, Cr retention capability, and coating performance.