Crack initiation associated with contact damage is of great interest for glass that experiences mechanical loads.  The stress field under an indent is dependent on a variety of factors, including the glass type, indenter acuity, amount and type of damage, and the presence of cracks.  In the present work, Raman mapping is used to describe the stress state in silica after indentation and in elastic bending.  Details of the measurement, including stress calibration and spatial resolution are described as well as experimental limitations.